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ASDL-4860
High Power Infrared Emitter (850nm) in Surface Mount Package
Data Sheet
Description
ASDL-4860 Infrared emitter is encapsulated in a compact SMT package that is specially catered for High Power application. This device represents best performance for light output, fast switching and low thermal resistance for heat dissipation. It utilizes AlGaAs LED technology and is optimized with high efficiency at emissive wavelength of 850nm.
Features
* Top Emitting Surface Mount Infrared LED * Ultra-Low Height Profile: H = 1.5mm, W=6.0mm, L=6.0mm * High Power * High Speed * Low Thermal Resistance * 850nm Wavelength * Design for High Power Application * Design to Drive High Current * Wide Viewing Angle * Lead-Free and RoHS Compliant * Tape & Reel for automation placement
Applications
* High Speed Machine Automated System * Non-Contact Position Sensing * Optical Sensing * Infrared Data Transmission * Security Applications
Ordering Information
Part Number ASDL-4860-C22 Packaging Tape & Reel Shipping Option 2000pcs
Package Outline
Tape and Reel Dimensions
All Dimensions are in Millimeters
2
Absolute Maximum Ratings at 25C
Parameter Peak Forward Current Continuous Forward Current Power Dissipation Reverse Voltage Operating Temperature Storage Temperature LED Junction Temperature Lead Soldering Temperature Symbol IFPK IFDC PDISS Vr TO TS TJ -40 -40 Min. Max 1 500 1.2 5 100 100 125 260 for 5 sec Unit A mA W V C C C C Reference Tp<10us Duty Cycle=10%
Electrical Characteristics at 25C
Parameter Forward Voltage Reverse Voltage Diode Capacitance Thermal Resistance, Junction/Base Symbol VF Vr CO Rqjs 5 50 20 Min. Typ. 1.4 Max. 2.2 Unit V V pF C/W Condition IF =500mA IR=100uA Vr=0V, f=1MHz
Optical Characteristics at 25C
Parameter Average On-Axis Intensity (1) Viewing Angle Peak wavelength Spectral Width Optical Rise Time Optical Fall Time Symbol IE 21/2 PK tr tf Min. 40 Typ. 45 120 850 40 15 10 Max. Unit mW/Sr deg nm nm ns ns IF = 500mA IF = 20mA IF = 20mA IF = 20mA Condition IF =500mA
Note (1): IE is measured with accuracy of + 11%
Typical Electrical / Optical Characteristics Curve (TA = 25C Unless Otherwise Stated)
1.2E-06 1.0E-06
Relative Radiant Power
80 70 60
8.0E-07 6.0E-07 4.0E-07 2.0E-07
IE (mW/Sr)
50 40 30 20 10
0.0E+00
0
200
400
600
800
1000
1200
0
0
200
400
Peak Wavelength (nm)
IF (mA)
600
800
1000
Figure 1. Peak Wavelength Vs Relative Radiant Power
3 2.5 2 VF (v) 1.5 1 0.5 0
Figure 2. Forward Current Vs Radiant Intensity
1 0.8 0.6 0.4 0.2 0
Ie - Relative Radiant Intensity
-0.8
0
200
400
IF (mA)
600
800
1000
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
Figure 3. Forward Current Vs Forward Voltage
600 500 400 Max IF (mA) 300 200 100 0
Figure 4. Angular Displacement Vs Relative Radiant Intensity
0
10
20
40 30 60 70 50 Solder Point Temperature (Ts)
80
90
100
Figure 5. Maximum Forward Current Vs Solder Point Temperature
4
Recommended Reflow Profile
255 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 100 150 200 P3 SOLDER REFLOW P4 COOL DOWN 250 300 t-TIME (SECONDS) R1 MAX 260C R3 R4
T - TEMPERATURE (C)
R2
60 sec to 90 sec Above 217 C
R5
P2 SOLDER PASTE DRY
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down Time maintained above liquidus point , 217C Peak Temperature Time within 5C of actual Peak Temperature Time 25C to Peak Temperature
Symbol P1, R1 P2, R2 P, R P, R4 P4, R5
DT 25C to 150C 150C to 200C 200C to 260C 260C to 200C 200C to 25C > 217C 260C 25C to 260C
Maximum DT/Dtime or Duration C/s 100s to 180s C/s -6C/s -6C/s 60s to 90s 20s to 40s 8mins
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260C (500F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice.
5
Recommended Land Pattern
Note: The additional solder resist is to improve heat dissipation. The bigger the surface area, the better is the thermal dissipation. The surface area depends on the substrate and total power used. If MC (Metal Core) PCB is used, the additional area will not be needed as the whole MC PCB conducts heat.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. AV02-027EN - April 27, 2007

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